diff options
| author | Len Brown <len.brown@intel.com> | 2012-10-09 01:35:52 -0400 |
|---|---|---|
| committer | Len Brown <len.brown@intel.com> | 2012-10-09 01:35:52 -0400 |
| commit | 29b19e250434c6193c8b8e4c34c9c6284dd4f101 (patch) | |
| tree | 8a1c8e308c9ae964f7fb612e921e10cf4c30ba15 /drivers/hwmon/Kconfig | |
| parent | 125c4c706b680c7831f0966ff873c1ad0354ec25 (diff) | |
| parent | c072fed95c9855a920c114d7fa3351f0f54ea06e (diff) | |
Merge branch 'release' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux into thermal
Conflicts:
drivers/staging/omap-thermal/omap-thermal-common.
OMAP supplied dummy TC1 and TC2,
at the same time that the thermal tree removed them
from thermal_zone_device_register()
drivers/thermal/cpu_cooling.c b/drivers/thermal/cpu_cooling.c
propogate the upstream MAX_IDR_LEVEL re-name
to prevent a build failure
Previously-fixed-by: Stephen Rothwell <sfr@canb.auug.org.au>
Signed-off-by: Len Brown <len.brown@intel.com>
Diffstat (limited to 'drivers/hwmon/Kconfig')
| -rw-r--r-- | drivers/hwmon/Kconfig | 10 |
1 files changed, 0 insertions, 10 deletions
diff --git a/drivers/hwmon/Kconfig b/drivers/hwmon/Kconfig index c74e73b2069a..c4633de64465 100644 --- a/drivers/hwmon/Kconfig +++ b/drivers/hwmon/Kconfig @@ -334,16 +334,6 @@ config SENSORS_DA9052_ADC This driver can also be built as module. If so, the module will be called da9052-hwmon. -config SENSORS_EXYNOS4_TMU - tristate "Temperature sensor on Samsung EXYNOS4" - depends on ARCH_EXYNOS4 - help - If you say yes here you get support for TMU (Thermal Management - Unit) on SAMSUNG EXYNOS4 series of SoC. - - This driver can also be built as a module. If so, the module - will be called exynos4-tmu. - config SENSORS_I5K_AMB tristate "FB-DIMM AMB temperature sensor on Intel 5000 series chipsets" depends on PCI |